2024 5th International Conference on Intelligent Design (ICID 2024)

Online Submission

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Important Dates

Full Paper Submission Date

Registration Deadline

Final Paper Submission Date

August 5, 2024

September 20, 2024

September 20, 2024

Welcome to ICID 2024

2024 5th International Conference on Intelligent Design (ICID 2024) will be held on October 25-27, 2024 in Xi'an, Shaanxi, China. 

ICID 2024 is to bring together innovative academics and industrial experts in the field of electromechanical, industry, environment, architecture, computer and intelligent design to a common forum. The primary goal of the conference is to promote research and developmental activities in intelligent electromechanical design, intelligent industrial design, intelligent environmental design, intelligent architectural design, digital design, computer technology, innovative design. And another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in intelligent design and related areas. 

We warmly welcome all universities, academic units and research enterprises to actively participate in and mobilize academic talents at home and abroad to participate in the ICID 2023 based on their actual needs. Relevant professionals to contribute and participate in the meeting, share in the industry leading technology and research achievements, promote academic exchanges, explore cooperation space, promote intelligent design to the digital, networked, intelligent design, green development path, in order to promote the world economy innovation, dynamic, interactive, make greater contribution to growth.

Previous ICID conferences have been held successfully. The history of the conference is as follows: 

The 1st conference (ICID 2020) was held on December 11-13, 2020 in Xi’an, Shaanxi, China. The accepted papers have been published in IEEE CPS on February 2021, and by IEEE Xplore and EI before May 2021. 

The 2nd conference (ICID 2021) was held on October 19, 2021 in Xi’an, Shaanxi, China (both online & offline). The accepted papers have been published in IEEE on December 2022, and by IEEE Xplore and EI before April 2022.

The 3rd conference (ICID 2022) was held on October 21-23, 2022 in Xi’an, Shaanxi, China (both online & offline). The accepted papers have been published in IEEE on December 2022, and by IEEE Xplore and EI before February 2023.

The 4th conference (ICID 2023) was held on October 20-22, 2023 in Xi’an, Shaanxi, China (both online & offline). The accepted papers have been published in IEEE on January 2023, and by IEEE Xplore.

Call for Papers

hot.gif The topics of interest include, but are not limited to:

智能工业设计 / Intelligent Industrial Design

· 工业产品数字化设计 / Digital Design of Industrial Products 

· 产品设计及智能模型制作 / Product Design and Intelligent Model Making

· 计算机辅助工业设计系统 / Computer Aided Industrial Design System

· 产品形态与造型设计研究 / Research on Product Form and Shape Design

· 智能化工业设计系统及技术应用 / Intelligent Industrial Design System and Technical Application

· 人机系统研究 / Man-machine System Research

· 文化创意产品设计研究 / Research on Cultural Creative Product Design

· 人机系统研究 / Man-machine System Research

· 系统和自动化 / Systems and Automation

· 智能产品设计 / Intelligent Product Design

· 网络与系统集成 / Network and System Integration

· 计算机控制系统 / Computer-control System

· 自动测试与故障诊断 / Automatic Testing and Troubleshooting

· 通信工程设计 / Telecomunication Engineering Design

· 其他相关主题 / Other Related Topics

智能机电设计 / Intelligent Electromechanical Design

· 机电一体化 / Mechatronics

· 机器学习 / Machine Learning

· 人工智能 / Artificial Intelligence

· 自动化技术 / Automation Technology

· 机器人技术 / Robot Technology

· 传感器技术 / Sensor Technology

· 机电能源效率 / Electromechanical Energy Efficiency

· 能源转换 / Energy Conversion

· 机电产品可靠性分析与寿命预测 / Electromechanical Product Reliability Analysis and Life Prediction

· 物联网技术在智能机电设备中的集成与应用 / Integration and Application of Internet of Things Technology in Intelligent Electromechanical Equipment

智能环境设计 / Intelligent Environmental Design

· 环境工程设计 / Environmental Engineering Design

· 地区及城市集群规划设计 / Regional and Urban Cluster Planning and Design

· 城市智能系统 / Urban Intelligent System

· 智能交通 / ITS (Intelligent Transportation System)

· 其他相关主题 / Other Related Topics

创新设计 / Innovative Design

· 创新技术设计 / innovative Technology Design

· 可持续设计 / Sustainable Design

· 虚拟设计 / Virtual Design

· 新媒体设计 / New Media Design

· 多学科融合设计 / Multidisciplinary design

· 动画设计 / Animation Design

· 数字媒体 / Digital Media Art

· 视觉传媒设计 / Visual Media Design

· 数字设计分析 / Digital Design Analysis

· 其他相关主题 / Other Related Topics

计算机技术 / Computer Technology

· 人工智能 / Artificial Intelligence

· 虚拟现实与人机交互 / Virtual Reality and Human-computer Interaction

· 计算机动画 / Computer Animation

· 软件工程 / Software Engineering

· 计算机建模 / Computer Modeling

· 数据模型与方法 / Data Model and Method

· 大数据搜索与信息检索技术 / Big Data Search and Information Retrieval Technology

· 智能信息融合 / Intelligent information fusion

· 其他相关主题 / Other Related Topics

数字化设计 / Digital Design

· 数字化产品建模 / Digital Product Modeling

· 数字化设计系统 / Digital Design System

· 数字化产品性能分析技术 / Digital Product Performance Analysis Technology

· 计算结辅助装配设计 / Computer-aided Assembly Design

· 产品开发的KBE技术 / KBE Technology for Product Development

· 虚拟产品创新设计自动化 / Innovation Design Automation for Virtual Product 

· 其他相关主题 / Other Related Topics

智能建筑设计 / Intelligent Architectural Design

· 智能化园区 / Intelligent Park

· 绿色建筑工程 / Environmentally-friendly Building Engineering

· 智能室内设计 / Intelligent Interior Design

· 智能化家居及设备 / Intelligent Home and Equipment

· 安防系统设计 / Security System Design

· 其他相关主题 / Other Related Topics


All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in conference proceedings, which will be submitted to EI Compendex, Inspec and Scopus.

Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

Conference Info.



All the attendees must register in advance in order to participate in conference.

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Please submit your full paper/abstract to us via the Electronic Submission System.

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All papers will be reviewed by two or three expert reviewers.

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Topics of interest for submission include, but are not limited to ...

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Registration Details

1. At least one author for each accepted final paper must pre-register.

2. Regular registration fees for ICID 2024 is 540 USD / 3800 CNY per paper.

3. If the length of the paper exceeds 4 Pages, the cost of Each Extra Page (begin at Page 5) is 55 USD / 400 CNY.

4. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

5. The registration fee does not include: ① Accommodation ② Visa application fee ③ Transportation fare.

6. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

7. For team submissions, please contact the conference secretary for the discounts. If your paper is accepted by committee and you registered for the conference, a 30% processing fee will be deducted if a retraction is requested.

Registration Fee



Early Bird (Registration before May. 31)

490 USD / 3500 CNY paper (4 pages) 

IEEE Member Registration (4 pages)

470 USD / 3300 CNY paper (4 pages) 

Regular Registration (4 pages)

540 USD / 3800 CNY paper (4 pages) 

Extra Pages (Begin at Page 5)

55 USD / 400 CNY extra page

Attendees without a Submission

210 USD / 1500 CNY person

Attendees without a Submission (Groups)

170 USD / 1200 CNY person (≥ 3 person)

Purchase Extra Proceedings/Journal copies

70 USD / 500 CNY book





(Oct. 25, 2024)



Oct. 26, 2024)

Keynote Speakers


(Oct. 26, 2024)



(Oct. 26, 2024)

Oral Presentations


(Oct. 26, 2024)



(Oct. 27, 2024)

Academic Investigation